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ASDL-4561
High Performance Infrared Emitter (870nm) ChipLED
Data Sheet
Description
ASDL-4561 Infrared emitter is a 0603 ChipLED SMT package that is designed for applications with low space requirements and high radiant intensity coupled with high speed. It is optimized for efficiency at emission wavelength of 870nm and encapsulated with a flat lens for wide viewing angle applications.
Features
* 870nm wavelength * Industry Standard Footprint: 0603 ChipLED SMT Package * Top Emitting * Low Forward Voltage * High Pulse Rate * High Speed * Wide Viewing Angle * Lead Free and ROHS Compliant * Tape & Reel for automation placement
Applications
* High-Speed Machine Automated System * Remote Control * Smoke Detector * Medical Applications * Non-Contact Position Sensing * Optical Encoders
Ordering Information
Part Number ASDL-4651-C22 Packaging Tape & Reel Shipping Option 12Kpcs
Package Outline
All Dimensions are in Millimeters
Tape and Reel Dimension
All Dimensions are in Millimeters (Inches)
2
Absolute Maximum Ratings at 25C
Parameter Peak Forward Current Symbol IFPK Min. Max 00 Unit mA Reference Tp=500ns Tw=100ns Duty Cycle=20%
Continuous Forward Current Power Dissipation Reverse Voltage Operating Temperature LED Junction Temperature Lead Soldering Temperature
IFDC PDISS Vr TO TJ 11 -40
60 120 85 110 260 for 5 sec
mA mW V C C C Ir=100uA
Electrical Characteristics at 25C
Parameter Forward Voltage Reverse Voltage Thermal Resistance Diode Capacitance CO Symbol VF Vr 11 400 50 Min. Typ. 1. 1.5 Max. 1.75 1.85 Unit V V V C/W pF Vr=0V, f=1MHz Condition IF=20mA IF=50mA IR=100uA
Optical Characteristics at 25C
Parameter Radiant On-Axis Intensity Viewing Angle Peak wavelength Spectral Width Optical Rise Time Symbol IE 21/2 PK tr Min. 1.64 Typ. 2.2 150 870 45 20 Max. Unit mW/Sr deg nm nm ns IF = 50mA IF = 50mA IFPK=500mA Duty Factor=20% Pulse Width=100ns IFPK=500mA Duty Factor=20% Pulse Width=100ns Condition IF=50mA
Optical Fall Time
tf
17
ns
Typical Electrical / Optical Characteristics Curve (TA = 25C Unless Otherwise Stated)
1.2 1.0 Relative Radiant Intensity If Forward Current (A) 0.8 0.6 0.4 0.2 0 700 0.12 0.10 0.08 0.06 0.04 0.02 0
800
900
1000
0
Peak Wavelength (nm)
0.5 1 Vf Forward Voltage (V)
1.5
Figure 1. Peak Wavelength Vs Relative Radiant Intensity
Figure 2. Forward Current Vs Forward Voltage
5 4 3 2 1 0
1 0.8 0.6 0.4 0.2 0
Radiant Intensity (mW/Sr)
0
20
40 60 80 Forward Current (mA)
100
120
Ie - Relative Radiant Intensity
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
Figure 3. Forward Current Vs Radiant Intensity
Figure 4.Angular Displacement Vs Relative Radiant Intensity
MAX - MAXIMUM DC CURRENT PER SEGMENT - mA
65 60 55 50 45 40 35 30 25 20 15 10 5 0 0 20 40 60 o TA - AMBIENT TEMPERATURE - C 80 100
I DC
Figure 5. Forward Current versus Ambient Temperature derated based on Tj - 110 C and thermal resistance at 400 C/W
4
Recommended Reflow Profile
255 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 100 150 200 P3 SOLDER REFLOW P4 COOL DOWN 250 300 t-TIME (SECONDS) R1 MAX 260C R3 R4
T - TEMPERATURE (C)
R2
60 sec to 90 sec Above 217 C
R5
P2 SOLDER PASTE DRY
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down Time maintained above liquidus point , 217C Peak Temperature Time within 5C of actual Peak Temperature Time 25C to Peak Temperature
Symbol P1, R1 P2, R2 P, R P, R4 P4, R5
DT 25C to 150C 150C to 200C 200C to 260C 260C to 200C 200C to 25C > 217C 260C 25C to 260C
Maximum DT/Dtime or Duration C/s 100s to 180s C/s -6C/s -6C/s 60s to 90s 20s to 40s 8mins
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260C (500F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice.
5
Recommended Land Pattern
All Dimensions are in Millimeters (Inches)
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. AV02-0276EN - April 27, 2007

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